Eur Ing Susan Pulko BSc (Lond), PhD (Nott), CEng, MIET, ARCS

Reader

Email:

Phone: +44 1482 465291

Web: http://www.hull.ac.uk/TLM/

Research Interests

Research is mainly focussed on numerical analysis, in particular the development and application of the Transmission Line Matrix technique. In recent years attention has focussed on algorithms for reverse-time modelling, estimation and control of spatially distributed systems.

Recent applications of forward modelling have been on a broad front. Packaging strategies based on gel refrigerants have been developed for temperature sensitive foods during transport in small quantities. These strategies have made use of both EPS and alternative, recyclable, biodegradable alternatives. Within the electronics industry, the dissipation of heat from passive components within multilayer PCBs has been accomplished and the group has produced software to assist in the layout of embedded components. Related work has concerned the design of conduction cooled high power populated PCBs and the design of heat sinks for use in sub-assemblies involving superconductors.

Selected Publications

• D.Lim, S.H.Pulko, The effect of spreader material on chip temperatures in IGBTs under pulsed operation, IET Circuits, Devices and Systems, 1, 126-136, 2007. 10.1049/iet-cds:20050227.
• A.Koay, A.J.Wilkinson, S.H.Pulko, The effect of feedback on the dynamics of TLM nodes for modelling diffusion, Int. J. Numerical Modelling, 18, 399-411, 2005. 10.1002/jnm.586. ISSN 0894-3370.
• D.Stubbs, S.H.Pulko, A.J.Wilkinson, Wrapping strategies for chilled food during transit, Trans. Inst Measurement and Cont., 26, 55-66, 2004. 10.1191/0142331204tm0106oa.
• S.H.Pulko, S. Parikh, Teaching soft skills to engineers, IJEEE, 40, 243-254, 2003. ISSN 0020-7209.
• R.Hocine, M.Boudchere Stambouli, D.Lim, S.Pulko, A.Saidane, 'A three dimensional simulation method for thermal effects in integrated gate bipolar transistors', J Inst. Circuit Tech, 29, 27-32, 2003. 10.1108/0305612310460793. ISSN 0305-6120.
• A.Kaoy, S.H.Pulko, A.J.Wilkinson 'Reverse transient modelling of thermal problems using TLM'- Numer Heat Trans Part B: Fundamentals, 44, 347-363, 2003. 10.1080/13836408.
• D.Stubbs, S.H.Pulko, A.J.Wilkinson, 'Sensitivity of embedded component temperature to PCB structure and heat transfer', IEE Circuits, Devices and Systems, 151, 73-77, 2003. 10.1049/ip-cds:20030184.
• D.M.Stubbs, S.H.Pulko, A.J.Wilkinson, Sensitivity of embedded component temperatures to PCB structure and heat transfer, IEEE Trans. Components and Pack Technology., 25, 701-707, 2002. 10.1109/TCAPT.2002.806175.
• G.Cutler, S.H.Pulko, 'Investigating UK Engineering Attrition and Countermeasures' Int J. Electrical Engineering Ed., Int J Elec Eng Ed, 39/3, 2002. ISSN 0020-7209.
• P. Enders, S.H. Pulko, D. Stubbs 'TLM for diffusion: consistent first timestep for the 2-dimensional case', Int. J. Numer. Mod, 15,251-259, 2002. 10.1002/jnm.440 ISSN 0894-3370.
• H.R Newton, S.H. Pulko, A. J. Wilkinson, 'TLM based models of bending transients and their application to the deformation of thin-walled ceramics during firing', Int. J. Numer. Mod, 15, 287-301,2002. 10.1002/jnm444. ISSN 0894-3370.
• S. H. Pulko, A. J. Wilkinson, A. Saidane 'TLM representation of the hyperbolic heat conduction equation', Int. J. Numer. Mod, 15, 303-315, 2002. 10.1002/jnm.445. ISSN 0894-3370.
• D. Stubbs, S. H. Pulko, A. J. Wilkinson, 'Numerical simulation of embedded passive components in multi-layer PCB structures',J. Inst. Circuit Tech., 28(1), 29-34, 2001.
• I.Badger, S. H. Pulko, A. J. Wilkinson, 'Reverse-time modelling of thermal problems using the transmission line matrix approach', Numer. Heat Trans:B, 40(3), 249-264, 2001. 10.1080/104077901752379648.