Laser Soldering

We have some 20 year’s experience in the application of Lasers to various soldering and other electronics manufacturing applications. We have carried out a number of EPSRC funded research projects as well as many R&D projects for industry.

Our research has covered:

  • Laser Types
    • CO2 Laser Soldering Systems
    • Single Solid state Laser Diodes
    • Multiple Diode Units
  • Surface Mount Components
    • Chip Components
    • SOIC Components
    • QFP Components
    • Flip Chip Components
  • Various Assemblies
    • Ceramic Hybrid Substrates
    • FR4 Fibreglass Circuit Boards
    • Substrateless Leadframes
    • Thermoplastic Mounted Assemblies
    • Polyamide Films
  • Modelling of Laser Soldering Operations
    • Finite Element Modelling (FEM)
    • Analytical Modelling

We have collaborated with a wide range of companies including (not in any particular order):

  • IBM
  • Siemens
  • Nortel
  • Dynapert
  • Exitech
  • Polyflex
  • Diomed
  • Newport